Manages electrical design delivery for optical modules, ASIC packaging, evaluation boards, and high-density PCB layouts. Leads signal and power integrity, thermal design, FEA initiatives, technical reviews, manufacturing transitions, and technology evaluations. Mentors engineering teams and collaborates cross-functionally to deliver innovative products meeting performance, quality, and timeline requirements.
As a Technical Manager in Electrical Design with the Optical Hardware team, you'll thrive in a collaborative in-person environment. Your role will involve managing technical delivery for optical modules, ASIC packaging, evaluation boards, and ensuring signal and power integrity. You'll lead initiatives in finite element analysis (FEA) and thermal design, driving development of cutting-edge technologies. Your contributions will directly impact the progression of innovative products within a dynamic, fast-paced setting that values teamwork and creativity. Benefits include engagement in transformative projects, professional growth opportunities, and a supportive atmosphere that fosters both personal and team success.
- Lead design and development of high-density PCB layouts, ensuring exceptional signal integrity.
- Collaborate with cross-functional teams to transition designs from concept to volume manufacturing.
- Conduct performance management to meet and exceed project specifications and timelines.
- Evaluate emerging technologies and methodologies to drive innovative solutions and improvements.
- Mentor and guide engineering teams, fostering a culture of collaboration and excellence in electrical design.
- Oversee technical reviews, ensuring high-quality standards and compliance with industry best practices.
- Engage directly with cutting-edge technologies in a dynamic, fast-paced environment.
- Contribute to groundbreaking projects that redefine performance and elevate our product offerings.
Must-Have:
- Degree in Electrical/Electric or Computer Engineering
- Deep understanding of highly complex electrical design principles
- Proven experience with miniaturization techniques
- Knowledge of signal integrity, power integrity, and thermal analysis
- Strong cross-functional collaboration skills
- Excellent communication skills for effective team interaction
Nice-To-Have:
- Experience integrating AI into product development workflows
- Familiarity with die packaging processes
- Experience in mechanical FEA analysis
- Proficiency in thermal analysis methodologies
- Background in highly efficient power supply design
Nokia Kanata, Ontario, CAN Office
600 March Rd, Kanata, ON, Canada, K2K 2T6
Nokia Ottawa, Ontario, CAN Office
Ottawa, Canada
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